|
| | 4,4'-DIHYDROXYDIPHENYLMETHANE Basic information |
| | 4,4'-DIHYDROXYDIPHENYLMETHANE Chemical Properties |
| Melting point | 162-164 °C | | Boiling point | 297.96°C (rough estimate) | | density | 1.0907 (rough estimate) | | refractive index | 1.6110 (estimate) | | storage temp. | Sealed in dry,Room Temperature | | solubility | DMSO (Slightly), Methanol (Slightly) | | form | neat | | pka | 9.91±0.10(Predicted) | | color | Off-White to Light Red | | Water Solubility | It is soluble in ethanol, ether, chloroform, alkali; slightly soluble in DMSO, insoluble in carbon disulfide and water. | | BRN | 2049425 | | InChIKey | PXKLMJQFEQBVLD-UHFFFAOYSA-N | | CAS DataBase Reference | 620-92-8(CAS DataBase Reference) | | EPA Substance Registry System | Phenol, 4,4'-methylenebis- (620-92-8) |
| | 4,4'-DIHYDROXYDIPHENYLMETHANE Usage And Synthesis |
| Chemical Properties | Off-White to Light Pink Solid | | Uses | Bisphenol F is a bisphenol derivative with antioxidant activities. Bisphenol F has been reported to exhibit estrogen agonistic properties. | | Uses | 4,4'-Dihydroxydiphenylmethane, is also used as a bisphenol derivative with antioxidant activities. Bisphenol F has been reported to exhibit estrogen agonistic properties. Bisphenol F is used to make epoxy resins and coatings for various applications, such as lacquers, varnishes, liners, adhesives, plastics, water pipes, dental sealants, and food packaging. | | Definition | ChEBI: A bisphenol that is methane in which two of the hydrogens have been replaced by 4-hydroxyphenyl groups. | | General Description | Bisphenol F (BPF), an endocrine disrupting compound, is a bisphenol analog, widely used as an alternative to BPA in the production of consumer products. BPF is also used in a variety of industrial applications, including lacquer coatings in cans, food packaging, sealants, dental composites, etc. | | Contact allergens | p,p-Bisphenol F is an allergenic
component of phenol-formaldehyde resins resol-type. |
| | 4,4'-DIHYDROXYDIPHENYLMETHANE Preparation Products And Raw materials |
|